DocumentCode
3396545
Title
Fast iterative solution algorithms for the frequency-domain layered finite-element based analysis of large-scale on-chip interconnect structures
Author
Sheng, Feng ; Jiao, Dan
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
231
Lastpage
234
Abstract
An effective preconditioner P is proposed in this work for solving the surface-unknown-based reduced system matrix in the frequency-domain layered finite element method. This preconditioner is effective because it can converge the iterative solution of the reduced system matrix in a few iterations. It is computationally efficient because P-1b with b being an arbitrary vector can be obtained in linear complexity in both CPU time and memory consumption. With this preconditioner, the reduced system matrix in the layered finite element method is solved efficiently. The algorithms are rigorous without making any approximation. They apply to any arbitrarily-shaped multilayer structure. Numerical and experimental results demonstrated the accuracy, effectiveness, and efficiency of the proposed fast solution algorithms in analyzing large-scale on-chip interconnects.
Keywords
finite element analysis; integrated circuit interconnections; iterative methods; large scale integration; matrix algebra; arbitrarily-shaped multilayer structure; fast iterative solution algorithms; frequency-domain layered finite-element based analysis; large-scale on-chip interconnect structures; linear complexity; memory consumption; surface-unknown-based reduced system matrix; Algorithm design and analysis; Capacitance; Dielectric substrates; Finite element methods; Frequency domain analysis; Integrated circuit interconnections; Iterative algorithms; Large-scale systems; Nonhomogeneous media; Transmission line matrix methods; On-chip; electromagnetic modeling; finite-element method; frequency domain; iterative solution; preconditioner;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675922
Filename
4675922
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