• DocumentCode
    3396545
  • Title

    Fast iterative solution algorithms for the frequency-domain layered finite-element based analysis of large-scale on-chip interconnect structures

  • Author

    Sheng, Feng ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    231
  • Lastpage
    234
  • Abstract
    An effective preconditioner P is proposed in this work for solving the surface-unknown-based reduced system matrix in the frequency-domain layered finite element method. This preconditioner is effective because it can converge the iterative solution of the reduced system matrix in a few iterations. It is computationally efficient because P-1b with b being an arbitrary vector can be obtained in linear complexity in both CPU time and memory consumption. With this preconditioner, the reduced system matrix in the layered finite element method is solved efficiently. The algorithms are rigorous without making any approximation. They apply to any arbitrarily-shaped multilayer structure. Numerical and experimental results demonstrated the accuracy, effectiveness, and efficiency of the proposed fast solution algorithms in analyzing large-scale on-chip interconnects.
  • Keywords
    finite element analysis; integrated circuit interconnections; iterative methods; large scale integration; matrix algebra; arbitrarily-shaped multilayer structure; fast iterative solution algorithms; frequency-domain layered finite-element based analysis; large-scale on-chip interconnect structures; linear complexity; memory consumption; surface-unknown-based reduced system matrix; Algorithm design and analysis; Capacitance; Dielectric substrates; Finite element methods; Frequency domain analysis; Integrated circuit interconnections; Iterative algorithms; Large-scale systems; Nonhomogeneous media; Transmission line matrix methods; On-chip; electromagnetic modeling; finite-element method; frequency domain; iterative solution; preconditioner;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675922
  • Filename
    4675922