DocumentCode
3396621
Title
Effects of partially broken HF signal return on different packaging levels
Author
Winkel, T.-M. ; Frech, R. ; Gneiting, Thomas
Author_Institution
IBM Deutschland Res. & Developmen GmbH, Boblingen
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
255
Lastpage
258
Abstract
Electro magnetic field effects for broken high frequency (HF) signal returns are analysed for discontinuities in different packaging levels. Board connectors with a huge signal count and high speed signals as well as typical multi chip module structures are analysed using 3D field calculations. Resulting coupling effects were calculated and also verified with time domain measurements. The results are discussed with respect to the impact on signal integrity.
Keywords
electric connectors; electronics packaging; 3D field calculations; board connectors; broken high frequency signal returns; electro magnetic field effects; multichip module structures; packaging levels; signal integrity; Connectors; Couplings; Frequency; Hafnium; Magnetic analysis; Magnetic field measurement; Packaging; Signal analysis; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675928
Filename
4675928
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