DocumentCode
3396756
Title
An H2-matrix-based integral-equation solver of linear-complexity for large-scale full-wave modeling of 3D circuits
Author
Chai, Wenwen ; Jiao, Dan
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
283
Lastpage
286
Abstract
State-of-the-art integral-equation based computational electromagnetic methods rely on techniques that can perform a matrix-vector multiplication in O(N log N) operations, with N being the matrix size. In this work, a fast integral-equation-based solver was developed for full-wave modeling of large-scale complicated 3D circuits. Both memory consumption and time complexity were shown to be O(N). The superior performance applies to any arbitrarily shaped 3D structure. Numerical results demonstrate its accuracy and efficiency.
Keywords
computational complexity; computational electromagnetics; integral equations; integrated circuit modelling; matrix algebra; network analysis; 3D circuits; H2-matrix-based integral-equation solver; computational electromagnetic methods; large-scale full-wave modeling; linear-complexity; matrix-vector multiplication; memory consumption; state-of-the-art integral-equation; time complexity; Central Processing Unit; Computational electromagnetics; Electrodynamics; Electromagnetic modeling; Hydrogen; Integral equations; Integrated circuit modeling; Integrated circuit packaging; Kernel; Large-scale systems; H2 matrix; Integral-equation methods; full-wave modeling; integrated circuits; package;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675935
Filename
4675935
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