• DocumentCode
    3396756
  • Title

    An H2-matrix-based integral-equation solver of linear-complexity for large-scale full-wave modeling of 3D circuits

  • Author

    Chai, Wenwen ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    State-of-the-art integral-equation based computational electromagnetic methods rely on techniques that can perform a matrix-vector multiplication in O(N log N) operations, with N being the matrix size. In this work, a fast integral-equation-based solver was developed for full-wave modeling of large-scale complicated 3D circuits. Both memory consumption and time complexity were shown to be O(N). The superior performance applies to any arbitrarily shaped 3D structure. Numerical results demonstrate its accuracy and efficiency.
  • Keywords
    computational complexity; computational electromagnetics; integral equations; integrated circuit modelling; matrix algebra; network analysis; 3D circuits; H2-matrix-based integral-equation solver; computational electromagnetic methods; large-scale full-wave modeling; linear-complexity; matrix-vector multiplication; memory consumption; state-of-the-art integral-equation; time complexity; Central Processing Unit; Computational electromagnetics; Electrodynamics; Electromagnetic modeling; Hydrogen; Integral equations; Integrated circuit modeling; Integrated circuit packaging; Kernel; Large-scale systems; H2 matrix; Integral-equation methods; full-wave modeling; integrated circuits; package;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675935
  • Filename
    4675935