Title :
Proximity interconnect technology utilizing transmission line coupling for Stacked VLSI chips
Author :
Iguchi, Daisuke ; Akiyama, Yutaka ; Ito, Tsuneo ; Otsuka, Kanji
Author_Institution :
Fuji Xerox Co., Ltd., Ebina
Abstract :
In this paper, we introduce a very high bandwidth proximity communication technique for Stacked LSIs. This technology is based on transmission line coupling between two differential pairs in the metal layers of each chip and can be implemented without modifying conventional chip fabrication process. We have demonstrated its feasibility using a single chip in which coupled two differential pairs of transmission lines are fabricated on different metal layers.
Keywords :
VLSI; integrated circuit interconnections; integrated circuit testing; transmission lines; VLSI chips; differential pairs; proximity communication; proximity interconnect technology; transmission line coupling; Bandwidth; CMOS technology; Couplings; Crosstalk; Phase measurement; Pulse measurements; Semiconductor device measurement; Testing; Transmission lines; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675937
