DocumentCode :
3396864
Title :
Signal integrity improvement in transmission lines backed by an EBG structure
Author :
Chen, Jin ; Abhari, Ramesh
Author_Institution :
Dept. of Electr. & Comp. Eng., McGill Univ., Montreal, QC
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
307
Lastpage :
310
Abstract :
In this paper, insertion loss in transmission lines embedded in a power distribution network (PDN) containing an Electromagnetic Bandgap (EBG) structure is investigated. Both fullwave simulations and measurement results show the loading EBG structure on the transmission coefficients of few investigated routing scenarios. In order to improve signal integrity, a solid conductor segment is inserted underneath the line on the EBG surface. The dimensions of the conductor segment are optimized for best transmission coefficient while maintaining noise suppression characteristics of the PDN.
Keywords :
photonic band gap; power distribution lines; transmission lines; EBG structure; electromagnetic bandgap structure; power distribution network; signal integrity improvement; solid conductor segment; transmission lines; Conductors; Electromagnetic measurements; Insertion loss; Metamaterials; Periodic structures; Power systems; Power transmission lines; Propagation losses; Transmission line measurements; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675941
Filename :
4675941
Link To Document :
بازگشت