DocumentCode
3396864
Title
Signal integrity improvement in transmission lines backed by an EBG structure
Author
Chen, Jin ; Abhari, Ramesh
Author_Institution
Dept. of Electr. & Comp. Eng., McGill Univ., Montreal, QC
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
307
Lastpage
310
Abstract
In this paper, insertion loss in transmission lines embedded in a power distribution network (PDN) containing an Electromagnetic Bandgap (EBG) structure is investigated. Both fullwave simulations and measurement results show the loading EBG structure on the transmission coefficients of few investigated routing scenarios. In order to improve signal integrity, a solid conductor segment is inserted underneath the line on the EBG surface. The dimensions of the conductor segment are optimized for best transmission coefficient while maintaining noise suppression characteristics of the PDN.
Keywords
photonic band gap; power distribution lines; transmission lines; EBG structure; electromagnetic bandgap structure; power distribution network; signal integrity improvement; solid conductor segment; transmission lines; Conductors; Electromagnetic measurements; Insertion loss; Metamaterials; Periodic structures; Power systems; Power transmission lines; Propagation losses; Transmission line measurements; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675941
Filename
4675941
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