Title :
Minimizing crosstalk noise in vias or pins by optimizing signal assignment in a high-speed differential bus
Author :
Zhou, Yaping ; Mandrekar, Rohan ; Zhou, Tingdong ; Chun, Sungjun ; Harvey, Paul ; Weekly, Roger
Author_Institution :
Syst. & Technol. Group, IBM, Austin, TX
Abstract :
Vias in packages and boards, land-grid-array pins, and connector pins introduce significant crosstalk in high-speed differential buses. There are many possible differential signal assignments in those areas that have very different electrical performance. This paper proposes and demonstrates an efficient method to find a large number of possible assignments and assess them to obtain an optimal assignment with the best performance.
Keywords :
crosstalk; field buses; interference suppression; connector pins; crosstalk noise minimization; high-speed differential bus; land-grid-array pins; signal assignment optimisation; vias; Acoustic noise; Connectors; Crosstalk; Electronics packaging; Inductance; Mutual coupling; Optimization methods; Pins; Scattering parameters; Signal analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675943