DocumentCode :
3396950
Title :
EM modeling
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
329
Lastpage :
330
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675947
Filename :
4675947
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3396950
