DocumentCode

3396950

Title

EM modeling

fYear

2008

fDate

27-29 Oct. 2008

Firstpage

329

Lastpage

330

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP

Conference_Location

San Jose, CA, USA

Print_ISBN

978-1-4244-2873-1

Type

conf

DOI

10.1109/EPEP.2008.4675947

Filename

4675947