DocumentCode :
3397065
Title :
An industry-oriented curriculum in the design and performance of electrical packaging and interconnect
Author :
Evans, Robert J. ; Scearce, Stephen ; Hsieh, Minjhing
Author_Institution :
SPRTG-High Speed Design Group, Cisco Syst. Inc., Research Triangle Park, NC
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
353
Lastpage :
356
Abstract :
The need for education in the performance analysis of electrical package and interconnect is strong in both industrial and academic research environments. While both the industrial and academic environments share much of the same basic theory in this subject, there are two distinct paths for the resulting applications of this knowledge. The industry requirements are detailed, practical skills that can be used immediately, while the education provided by the academic institutions is more focused on basic theory and research skill development. This paper offers a contrast of these approaches, with a more in-depth description of how Cisco systems has developed their own detailed training curriculum in signal integrity engineering.
Keywords :
electronic engineering education; electronics packaging; integrated circuit design; integrated circuit interconnections; training; electrical packaging; industry-oriented curriculum; interconnect; signal integrity engineering; training curriculum; Communication industry; Costs; Design engineering; Industrial training; Integrated circuit interconnections; Knowledge engineering; Packaging; Performance analysis; Signal analysis; Signal design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675954
Filename :
4675954
Link To Document :
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