DocumentCode :
3397230
Title :
Role of nano-filler on partial discharge resistance and dielectric breakdown strength of micro-Al2O3 / epoxy composites
Author :
li, Zhe ; Okamoto, Kenji ; Ohki, Yoshimichi ; Tanaka, Toshikatsu
Author_Institution :
Grad. Sch. of Inf., Production & Syst., Waseda Univ., Kitakyushu, Japan
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
753
Lastpage :
756
Abstract :
Epoxy resin often suffers lower dielectric breakdown strength if micro-fillers are loaded. It might be possible to raise the once lowered breakdown strength, if nano-fillers are added. In this paper, such performances were investigated on model specimens consisting of alumina (Al2O3). First of all, PD (partial discharge) behavior on the surfaces of samples was clarified in the insulation system consisting of a flat copper electrode attached on an epoxy substrate. Then, on the basis of finding, the breakdown strengths were investigated by using a sphere to sphere electrode structure with a flat sample inserted. Several materials consist of neat epoxy, 5 %wt nano-Al2O3/ epoxy composite, 60 %wt micro-Al2O3/ epoxy composite and 2 %wt nano- 60 % wt micro-Al2O3/ epoxy composite. It was found that nano-micro- Al2O3/ epoxy composite is higher in both dielectric strength and PD resistance than micro-Al2O3/ epoxy composite.
Keywords :
aluminium compounds; electric breakdown; epoxy insulation; filled polymers; nanocomposites; partial discharges; Al2O3; alumina-epoxy composites; dielectric breakdown strength; epoxy substrate; flat copper electrode; insulation system; nanofiller; partial discharge behavior; partial discharge resistance; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Epoxy resins; Immune system; Partial discharges; Surface discharges; Thermal conductivity; Thermal resistance; breakdown strength; epoxy; nano-Al2O3; nano-micro-composite; partial discharge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252321
Filename :
5252321
Link To Document :
بازگشت