Title :
Development of a solder bump technique for contacting a three-dimensional multi electrode array
Author :
Frieswijk, Theo A. ; Bielen, Jeroen A. ; Rutten, Wim L C
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
Abstract :
The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 μm bumps at 120 μm heart-to-heart spacing
Keywords :
arrays; bioelectric phenomena; biological techniques; microactuators; microelectrodes; neurophysiology; soldering; 120 mum; CMOS chip; Si; buffer amplifiers; current sources; epoxy-embedded needles; heart-to-heart spacing; insulated needle shafts; intraneural recording; intraneural stimulation; iridium oxide electrode; multielectrode sensor/actuator system; multiplexers; nickel pads array; silicon needles; solder bump technique; three-dimensional multielectrode array contacting; Aluminum; Biomedical electrodes; Chromium; Copper; Etching; Needles; Nickel; Resists; Silicon; Tin;
Conference_Titel :
Engineering in Medicine and Biology Society, 1995., IEEE 17th Annual Conference
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-2475-7
DOI :
10.1109/IEMBS.1995.579531
