• DocumentCode
    3397686
  • Title

    Dielectric breakdown of gamma-ray irradiated epoxy resin in crossed field

  • Author

    Du, B.X. ; Liu, H.J. ; Wang, K.F. ; Zhen, Yin

  • Author_Institution
    Sch. of Electr. Eng. & Autom., Tianjin Univ., Tianjin, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    647
  • Lastpage
    650
  • Abstract
    This paper describes the effects of magnetic field and low pressure on dielectric breakdown of gamma-ray irradiated epoxy resin. The experiment was carried out by applying a dc pulse voltage with the intervals adjusted from 5 ms to 10 ms. The samples were irradiated in air up to 100 kGy and then up to 1000 kGy with a dose rate of 10 kGy/h by using a 60Co gamma-source. The magnetic flux density of the magnetic filed was 495 mT and the pressure was reduced to 1 kPa. The effects of the pressure, magnetic filed and gamma-ray irradiation on the time to dielectric breakdown and discharge quantity were studied. Obtained results revealed that the time to dielectric breakdown increased with increasing the total dose of radiation and was delayed by decreasing the pressure and increasing the magnetic field. The discharge quantity decreased with increasing the total dose of gamma-ray irradiation and increasing the magnetic field, but increased with decreasing the pressure.
  • Keywords
    electric breakdown; epoxy insulation; gamma-ray effects; magnetic field effects; Co; crossed field; dielectric breakdown; gamma ray irradiated epoxy resin; low pressure; magnetic field effect; magnetic flux density; magnetic flux density 495 mT; pressure 1 kPa; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electrodes; Epoxy resins; Magnetic fields; Magnetic flux; Magnetic materials; Polymers; Superconducting magnets; dielectric breakdown; gamma-ray irradiation; low pressure; magnetic field;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252346
  • Filename
    5252346