• DocumentCode
    3397728
  • Title

    Impact of MOV Operation on Power Quality in transmission lines compensated by TCSC

  • Author

    Khederzadeh, Mojtaba

  • Author_Institution
    Dept. of Electr. Eng., Power & Water Univ. of Technol. (PWUT), Tehran
  • fYear
    2008
  • fDate
    21-24 April 2008
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    TCSC as a dynamic system, besides its capability in increasing power transfer in transmission lines, can be used to enhance different power system issues. TCSC´s different advantages can be classified as steady-state and transient ones. During a fault, TCSC can enhance power quality by limiting the current and help to keep the voltage as high as possible. Different modes of TCSC have different effects on power quality. In this regard the MOV has a salient role in soft transferring from one mode to another. If the MOV is not triggered during TCSC transition modes, considerable voltage fluctuations are observed that last for a relatively long time. This is not favorable when sensitive loads are connected to the bus that a transmission line with TCSC is available. These fluctuations are not favorable to protective relays, too. In this paper, the impact of MOV of a TCSC on power quality is investigated. Different operating modes of TCSC and their behavior with/without triggering of MOV is simulated and analyzed.
  • Keywords
    fault diagnosis; power capacitors; power supply quality; power transmission; varistors; TCSC transition modes; metal oxide varistor; power quality; power system; protective relays; thyristor controlled series capacitor; transmission lines; voltage fluctuations; Fluctuations; Power capacitors; Power quality; Power system dynamics; Power system faults; Power system transients; Power transmission lines; Steady-state; Thyristors; Voltage; Inrush current; Power Quality; Thyristor Controlled Series Capacitor (TCSC); Transformer; Voltage Sag;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference and Exposition, 2008. T&D. IEEE/PES
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-1903-6
  • Electronic_ISBN
    978-1-4244-1904-3
  • Type

    conf

  • DOI
    10.1109/TDC.2008.4517146
  • Filename
    4517146