Title :
Optimising the wave soldering process for lead free solders
Author :
Stoyanov, S. ; Bailey, C. ; Saxena, N. ; Adam, S.
Author_Institution :
Sch. of Comput. & Math. Sci., Greenwich Univ., London, UK
Abstract :
Nitrogen is now used in wave soldering machines to help lower the amount of dross that can be formed on the solder bath surface. The paper provides details on the use of computational fluid dynamics in helping understand the flow profiles of nitrogen in a wave soldering machine and to predict the concentration of nitrogen and oxygen around the solder bath.
Keywords :
computational fluid dynamics; computer aided analysis; engineering computing; flow; nitrogen; optimisation; oxygen; wave soldering; N2; O2; computational fluid dynamics; dross; flow profiles; lead free solders; nitrogen; oxygen; printed circuit board manufacturing process; wave soldering process; Computational fluid dynamics; Environmentally friendly manufacturing techniques; Fluid flow; Furnaces; Lead; Nitrogen; Oxygen; Soldering; Surface waves; Temperature;
Conference_Titel :
Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on
Print_ISBN :
0-7803-8806-2
DOI :
10.1109/AGEC.2005.1452331
