Title :
A fast and accurate method for interconnect current calculation
Author :
Shao, Muzhou ; Wong, D.F. ; Gao, Youxin ; Cao, Huijing ; Yuan, Li-Pen
Author_Institution :
Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Abstract :
As VLSI technology continues to scale down, the electromigration problem has become one of the dominant factors in determining system reliability. This problem is caused by high current density flowing in the metal interconnect. Therefore, current evaluation is a crucial concern in IC design. SPICE level circuit simulators are excellent for doing current calculation; however, their running times are too expensive to be used repeatedly in design synthesis loops. In this paper, we propose an efficient approach for the interconnect current calculation. This method is based on moment matching but does not need high order moments. It only needs to traverse the RC tree once to get the mean current value of every segment, while traversing the tree once more is enough for the RMS current calculation, and two more traversals is sufficient for the peak current calculation. We apply our method to a larger number of interconnects getting close-to-SPICE accuracy at significantly faster runtimes. In particular, applying the method to 17,387 wire segments in the clock tree of a commercial IC, we obtained that the average deviation error of mean current is 0.0569%, average RMS current error is 0.703% and average peak current error is 6.552%. It took 28 hours for HSPICE to get the current value of all the wire segments and it only took our method 156 seconds.
Keywords :
SPICE; VLSI; circuit CAD; current density; electromigration; error analysis; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; 156 s; 28 hour; HSPICE; IC design; RC tree; RMS current calculation; SPICE level circuit simulators; VLSI technology scaling; average RMS current error; average deviation error; average peak current error; clock tree; current density; design synthesis loops; electromigration; interconnect current calculation; mean current; metal interconnect; moment matching; moment order; peak current; running time; runtimes; segment mean current value; system reliability; wire segments; Circuit simulation; Circuit synthesis; Current density; Electromigration; Integrated circuit interconnections; Reliability; Runtime; SPICE; Very large scale integration; Wire;
Conference_Titel :
Design Automation Conference, 2003. Proceedings of the ASP-DAC 2003. Asia and South Pacific
Print_ISBN :
0-7803-7659-5
DOI :
10.1109/ASPDAC.2003.1194990