DocumentCode
3398479
Title
Reduction of crosstalk noise by optimizing 3-D configuration of the routing grid
Author
Sakai, Atsushi ; Yamada, Takashi ; Matsushita, Yoshifbmi ; Yasuura, Hiroto
Author_Institution
Mater. & Devices Dev. Center, Sanyo Electr. Co. Ltd., Gifu, Japan
fYear
2003
fDate
21-24 Jan. 2003
Firstpage
49
Lastpage
52
Abstract
In this paper, we propose novel physical design techniques for a sub-quarter micron system-on-a-chip (SoC). By appropriately optimizing the routing grid space or the cell utilization ratio, the coupling effects are almost eliminated. By employing our proposed techniques on a 0.13 μm six-layer physical design, the longest path delay is significantly decreased by 15% maximum without the need for process improvement. This significant delay reduction, which corresponds to a half generation of process progress, greatly accelerates the performance of SoCs.
Keywords
CMOS integrated circuits; capacitance; circuit layout CAD; circuit optimisation; crosstalk; delays; integrated circuit layout; integrated circuit noise; network routing; system-on-chip; 0.13 micron; 3D configuration optimisation; cell utilization ratio; coupling effects elimination; crosstalk noise reduction; path delay reduction; physical design techniques; routing grid; six-layer physical design; sub-quarter micron SoC; Acceleration; Capacitance; Circuits; Crosstalk; Delay; Repeaters; Routing; Space technology; System-on-a-chip; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2003. Proceedings of the ASP-DAC 2003. Asia and South Pacific
Print_ISBN
0-7803-7659-5
Type
conf
DOI
10.1109/ASPDAC.2003.1194992
Filename
1194992
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