DocumentCode :
3398507
Title :
Prospects of multilevel VSC technologies for power transmission
Author :
Gemmell, B. ; Dorn, J. ; Retzmann, D. ; Soerangr, D.
Author_Institution :
Siemens USA, Milpitas, CA
fYear :
2008
fDate :
21-24 April 2008
Firstpage :
1
Lastpage :
16
Abstract :
Deregulation and privatization are posing new challenges to high voltage transmission and distributions systems. System components are loaded up to their thermal limits, and power trading with fast varying load patterns is leading to an increasing congestion. In addition to this, the dramatic global climate developments call for changes in the way electricity is supplied. Innovative solutions with HVDC (High Voltage Direct Current) and FACTS (Flexible AC Transmission Systems) have the potential to cope with the new challenges. New power electronic technologies with self-commutated converters provide advanced technical features, such as independent control of active and reactive power, the capability to supply weak or passive networks and less space requirements. In many applications, the VSC (Voltage-Sourced Converter) has become a standard for self-commutated converters and will be increasingly more used in transmission and distribution systems in the future. This kind of converter uses power semiconductors with turn-off capability.
Keywords :
power convertors; transmission networks; high voltage transmission systems; independent control; load patterns; power electronic technologies; power trading; power transmission; reactive power; self-commutated converters; voltage-sourced converter; Converters; Flexible AC transmission systems; HVDC transmission; Power conversion; Power markets; Power transmission; Privatization; Space technology; Thermal loading; Voltage; Elimination of Bottlenecks in Transmission; Enhanced Grid Access for Regenerative Energy Sources (RES); Increase in Transmission Capacity; Security and Environmental Sustainability of Supply; Smart Grid Technologies;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transmission and Distribution Conference and Exposition, 2008. T&D. IEEE/PES
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4244-1903-6
Electronic_ISBN :
978-1-4244-1904-3
Type :
conf
DOI :
10.1109/TDC.2008.4517192
Filename :
4517192
Link To Document :
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