DocumentCode
3398587
Title
Experimental research on optimizing the layout of electronic components in closed electronic equipment with heat pipe
Author
Sun Shimei ; Zheng Liqiu
Author_Institution
Jilin Inst. of Archit. & Civil Eng., Changchun, China
fYear
2011
fDate
19-22 Aug. 2011
Firstpage
2326
Lastpage
2331
Abstract
Heat pipe heat exchanger is a kind of efficient heat recovery. There is a great development on system research of electronic equipment, because of its high heat transfer efficiency, small temperature drop, simple structure, easy to control and no energy dissipation characteristics. In this paper, SINDA/FLUINT which is a professional thermal analysis software researched performance of the heat pipe heat exchanger, established test-bed to test the heat exchanger performance of heat pipe, compared with the simulation results and measured data, depth analysis the use of heat pipe on cooling problem of electronics industry to provide a theoretical basis for large-scale application of heat pipe technology.
Keywords
cooling; electronics industry; heat exchangers; heat pipes; heat recovery; temperature; closed electronic equipment; cooling problem; electronic component; electronics industry; heat pipe heat exchanger; heat recovery; heat transfer; temperature drop; thermal analysis software; Electronic components; Electronic equipment; Heat transfer; Space heating; Temperature distribution; Temperature measurement; electronic; equipment; heat pipe heat exchanger; numerical simulation; structural optimization;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronic Science, Electric Engineering and Computer (MEC), 2011 International Conference on
Conference_Location
Jilin
Print_ISBN
978-1-61284-719-1
Type
conf
DOI
10.1109/MEC.2011.6025959
Filename
6025959
Link To Document