DocumentCode :
3398587
Title :
Experimental research on optimizing the layout of electronic components in closed electronic equipment with heat pipe
Author :
Sun Shimei ; Zheng Liqiu
Author_Institution :
Jilin Inst. of Archit. & Civil Eng., Changchun, China
fYear :
2011
fDate :
19-22 Aug. 2011
Firstpage :
2326
Lastpage :
2331
Abstract :
Heat pipe heat exchanger is a kind of efficient heat recovery. There is a great development on system research of electronic equipment, because of its high heat transfer efficiency, small temperature drop, simple structure, easy to control and no energy dissipation characteristics. In this paper, SINDA/FLUINT which is a professional thermal analysis software researched performance of the heat pipe heat exchanger, established test-bed to test the heat exchanger performance of heat pipe, compared with the simulation results and measured data, depth analysis the use of heat pipe on cooling problem of electronics industry to provide a theoretical basis for large-scale application of heat pipe technology.
Keywords :
cooling; electronics industry; heat exchangers; heat pipes; heat recovery; temperature; closed electronic equipment; cooling problem; electronic component; electronics industry; heat pipe heat exchanger; heat recovery; heat transfer; temperature drop; thermal analysis software; Electronic components; Electronic equipment; Heat transfer; Space heating; Temperature distribution; Temperature measurement; electronic; equipment; heat pipe heat exchanger; numerical simulation; structural optimization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mechatronic Science, Electric Engineering and Computer (MEC), 2011 International Conference on
Conference_Location :
Jilin
Print_ISBN :
978-1-61284-719-1
Type :
conf
DOI :
10.1109/MEC.2011.6025959
Filename :
6025959
Link To Document :
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