• DocumentCode
    3398587
  • Title

    Experimental research on optimizing the layout of electronic components in closed electronic equipment with heat pipe

  • Author

    Sun Shimei ; Zheng Liqiu

  • Author_Institution
    Jilin Inst. of Archit. & Civil Eng., Changchun, China
  • fYear
    2011
  • fDate
    19-22 Aug. 2011
  • Firstpage
    2326
  • Lastpage
    2331
  • Abstract
    Heat pipe heat exchanger is a kind of efficient heat recovery. There is a great development on system research of electronic equipment, because of its high heat transfer efficiency, small temperature drop, simple structure, easy to control and no energy dissipation characteristics. In this paper, SINDA/FLUINT which is a professional thermal analysis software researched performance of the heat pipe heat exchanger, established test-bed to test the heat exchanger performance of heat pipe, compared with the simulation results and measured data, depth analysis the use of heat pipe on cooling problem of electronics industry to provide a theoretical basis for large-scale application of heat pipe technology.
  • Keywords
    cooling; electronics industry; heat exchangers; heat pipes; heat recovery; temperature; closed electronic equipment; cooling problem; electronic component; electronics industry; heat pipe heat exchanger; heat recovery; heat transfer; temperature drop; thermal analysis software; Electronic components; Electronic equipment; Heat transfer; Space heating; Temperature distribution; Temperature measurement; electronic; equipment; heat pipe heat exchanger; numerical simulation; structural optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronic Science, Electric Engineering and Computer (MEC), 2011 International Conference on
  • Conference_Location
    Jilin
  • Print_ISBN
    978-1-61284-719-1
  • Type

    conf

  • DOI
    10.1109/MEC.2011.6025959
  • Filename
    6025959