DocumentCode
3399343
Title
Insulation life-span models for electrical and thermal aging under continuous high square impulses voltage
Author
Kaijiang, Cao ; Guangning, Wu ; Liren, Zhou ; Xiaoxia, Guo ; Kegang, Lei ; Bo, Gao
Author_Institution
Sch. of Electr. Eng., Southwest Jiaotong Univ., Chengdu, China
fYear
2009
fDate
19-23 July 2009
Firstpage
285
Lastpage
288
Abstract
Stator insulation of inverter-fed motors experiences continuous impulses with significant harmonics and transients, which may result in early failure. There are many differences in insulation aging mechanism between under continuous impulses and sine waves. In order to test insulation properties under continuous impulses, a new insulation aging test system is used to simulate the aging effect of converter on the winding insulation in the inverter-fed motors. The influences of multi-stress including impulse amplitude-temperature, impulse frequency-temperature and impulse frequency-amplitude on insulation lifetime are investigated. And the test data under different conditions are analyzed by the statistic analysis method of Weibull distribution. Finally, insulation life models for multi-stress is developed based on the above test results, which is helpful for the insulation design of inverter-fed motor.
Keywords
Weibull distribution; ageing; electric motors; insulation; stators; Weibull distribution; continuous high square impulses voltage; electrical aging; insulation aging; insulation life-span; inverter-fed motors; stator insulation; thermal aging; winding insulation; Aging; Dielectrics and electrical insulation; Frequency; Impulse testing; Insulation testing; Statistical analysis; Statistical distributions; Stators; System testing; Voltage; aging; insulation; inverter-fed motor; life model;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location
Harbin
Print_ISBN
978-1-4244-4367-3
Electronic_ISBN
978-1-4244-4368-0
Type
conf
DOI
10.1109/ICPADM.2009.5252428
Filename
5252428
Link To Document