DocumentCode :
3399556
Title :
Mechanical stress induced whiskers
Author :
Horváth, Barbara ; Harsányi, Gábor
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear :
2009
fDate :
17-20 Sept. 2009
Firstpage :
389
Lastpage :
393
Abstract :
Electroplated tin surfaces grow whiskers easily and mechanical loads tend to accelerate this. Our aim was to define how the different kinds of mechanical loads induce the growth of tin whiskers. We have applied 3 types of mechanical loads on component leads covered by either electroplated tin or electroplated tin with silver underlayer. The method of testing was pressing perpendicularly three types of heads on the two types of layers, all equally with 3 N force for 400 hours. These types of head shapes were: spear (60°), pointed (30°), round (r = 250 ¿m). The observed results have shown that different mechanical defects induce the growth of whiskers in different ways and using underlayers have also changed the amount of whiskers grown on the surface in case of using the same needle shape and force.
Keywords :
compressive testing; deformation; electroplating; internal stresses; tin; whiskers (crystal); Sn; electroplating; mechanical defects; mechanical loads; mechanical stress; pressing; whiskers; Compressive stress; Copper; Electronics packaging; Injuries; Residual stresses; Shape; Substrates; Temperature; Testing; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Conference_Location :
Gyula
Print_ISBN :
978-1-4244-5132-6
Electronic_ISBN :
978-1-4244-5133-3
Type :
conf
DOI :
10.1109/SIITME.2009.5407337
Filename :
5407337
Link To Document :
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