VPS and reliability of solder joint

Author

Pietrikova, Alena ; Durisin, J.

Author_Institution

Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia

fYear

2009

fDate

17-20 Sept. 2009

Firstpage

395

Lastpage

398

Abstract

This paper deals with presentation of some new aspects of solder ternary alloy 96.5Sn3Ag0.5Cu (wt.%) - SAC305, in order to determine variations in mechanical properties and microstructure caused by treatment in vapour phase soldering (VPS) as well as by accelerated isothermal aging. These specimens have been melted and solidified on HASL (hot air solder levelling) and Ni/Au (ENIG) PCB (printed circuit board) substrate in order to prevent compositional changes due to interfacial reactions. Emphasis was placed on studying the effect of anomalous behaviours of intermetallic compounds Cu₆Sn₅ during ageing processes.

Keywords

ageing; copper alloys; crystal microstructure; melting; reliability; silver alloys; soldering; solders; solidification; tin alloys; SAC305; SnAgCu; VPS; accelerated isothermal aging; ageing; hot air solder levelling; melting; microstructure; printed circuit board; reliability; solder joint; solidification; vapour phase soldering; Aging; Copper; Electronics packaging; Gold; Isothermal processes; Mechanical factors; Microstructure; Soldering; Surface finishing; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for

Conference_Location

Gyula

Print_ISBN

978-1-4244-5132-6

Electronic_ISBN

978-1-4244-5133-3

Type

conf

DOI

10.1109/SIITME.2009.5407338

Filename

5407338