• DocumentCode
    3399578
  • Title

    Noise-aware buffer planning for interconnect-driven floorplanning

  • Author

    Li, Shu-Min ; Cherng, Eh-Huai ; Chang, Yao-Wen

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2003
  • fDate
    21-24 Jan. 2003
  • Firstpage
    423
  • Lastpage
    426
  • Abstract
    Crosstalk-induced noise has become a key problem in interconnect optimization when technology improves, spacing diminishes, and coupling capacitance/inductance increases. Buffer insertion/sizing is one of the most effective and popular techniques to reduce interconnect delay and decouple coupling effects. It is traditionally applied to post-layout optimization. However, it is obviously infeasible to insert/size hundreds of thousands of buffers during the post-layout stage when most routing regions are occupied. Therefore, it is desirable to incorporate buffer planning into floorplanning to ensure timing closure and design convergence. In this paper, we first derive formulae of buffer insertion for timing and noise optimization, and then apply the formulae to compute the feasible regions for inserting buffers to meet both timing and noise constraints. Experimental results show that our approach achieves an average success rate of 80.9% (78.2%) of nets meeting timing constraints alone (both timing and noise constraints) and consumes an average extra area of only 0.49% (0.66%) over the given floorplan, compared with the average success rate of 75.6% of nets meeting timing constraints alone and an extra area of 1.33% by the BBP method (J. Cong et al, Proc. ICCAD, pp. 358-363, 1999).
  • Keywords
    buffer circuits; circuit optimisation; coupled circuits; integrated circuit interconnections; integrated circuit layout; integrated circuit noise; interference (signal); area consumption; buffer insertion; buffer sizing; coupling capacitance; coupling effects; coupling inductance; crosstalk-induced noise; decoupling; design convergence; floorplanning; interconnect delay reduction; interconnect optimization; interconnect-driven floorplanning; noise constraints; noise optimization; noise-aware buffer planning; post-layout optimization; timing closure; timing constraints; timing optimization; Capacitance; Circuit optimization; Convergence; Crosstalk; Delay effects; Inductance; Integrated circuit interconnections; Meeting planning; Routing; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2003. Proceedings of the ASP-DAC 2003. Asia and South Pacific
  • Print_ISBN
    0-7803-7659-5
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2003.1195052
  • Filename
    1195052