Title :
Smart pixel optics and packaging
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
Abstract :
This talk will review several optical design and system packaging approaches explored in the past and currently under investigation in demonstration systems. To make the jump to a commodity-level smart pixel platform, new components and approaches will be needed and examples of potential useful techniques will be surveyed.
Keywords :
packaging; smart pixels; packaging; smart pixel optics; Costs; Electronic packaging thermal management; Electronics packaging; High speed optical techniques; Integrated optics; Optical arrays; Optical devices; Optical refraction; Optical sensors; Smart pixels;
Conference_Titel :
Advanced Applications of Lasers in Materials Processing/Broadband Optical Networks/Smart Pixels/Optical MEMs and Their Applications. IEEE/LEOS 1996 Summer Topical Meetings:
Conference_Location :
Keystone, CO, USA
Print_ISBN :
0-7803-3175-3
DOI :
10.1109/LEOSST.1996.540737
