Circuit models for power/ground planes on PCBs using SPICE method

Power planes consisting of two parallel conducting planes: power and ground, are widely used on high-speed printed circuit boards. In was presented an efficient numerical approach based on the 2D FDM (finite difference method) to model the power/ground planes on a PCB in frequency domain and how to choose decoupling capacitors for a PDS (Power Delivery System) using a dedicate software. The goal of this paper is to use the same numerical approach based on FDM, to analyze power/ground planes, but the power structure will be modeled using SPICE programs. Using SPICE, power/ground planes of arbitrary shape can be modeled efficiently both in the time-domain and frequency domain, along with the circuit components connected to the planes.