Abstract :
The following topics are dealt with: electronic components and IC package types; printed circuit board; interconnection technology and packaging; electronic package and module modeling, simulation and design (CAE-CAD-CAM); electronic system design, communication, biomedical and measurement applications; electromagnetic compatibility and signal integrity analysis; thermal and power management in electronic modules; reliability, life-time prediction and quality management; networking and Internet education.
Keywords :
CAD/CAM; Internet; biomedical measurement; computer aided engineering; electromagnetic compatibility; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; modules; thermal management (packaging); CAD; CAE; CAM; IC package; Internet education; biomedical measurement; electromagnetic compatibility; electronic components; electronic package; interconnection packaging; interconnection technology; lifetime prediction; module modeling; power management; printed circuit board; quality management; reliability; signal integrity; thermal management;
Conference_Titel :
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Conference_Location :
Gyula
Print_ISBN :
978-1-4244-5132-6
DOI :
10.1109/SIITME.2009.5407394
