DocumentCode :
3400770
Title :
Effect of modifier TMPTMA on electrical properties of cured epoxy system for V.P.I. resin
Author :
Duan, Jingkuan ; Kim, Chonung ; Jiang, Pingkai ; Liu, Fei ; Wang, Genlin ; Zhang, Jun ; Huang, Xingyi
Author_Institution :
Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
113
Lastpage :
116
Abstract :
V.P.I. is the most advanced impregnation technology for the electrical machines that have been developed. With the rapid development of the electrical industry, demands of improving the properties of V.P.I. resins become higher and higher. It is of practical significance to investigate the effect of the modification of the epoxy resin TMPTMA on the cross-linking structure, the DC electrical resistivity and dielectric breakdown characteristics of the cured epoxide for V.P.I. insulation. This paper aims to explore the effect of TMPTMA concentration on the temperature dependence of the DC resistivity of the cured system and to study the dielectric breakdown behaviors of the cured systems with different TMPTMA concentrations. The modification of the epoxy resin by TMPTMA has been found to surely provide the possibility for improving the density of the cross-linking structures, electrical properties and thermal stability for V.P.I. resin based on the epoxy resin.
Keywords :
electric breakdown; electric machines; polymers; DC electrical resistivity; cross-linking structure; cured epoxy system; dielectric breakdown characteristic; electrical industry; electrical machines; electrical properties; epoxy resin; Chemicals; Conductivity; Curing; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electrical resistance measurement; Epoxy resins; Temperature dependence; Testing; V.P.I.; dielectric breakdown; resistivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252494
Filename :
5252494
Link To Document :
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