DocumentCode
3400808
Title
Multi-media “DFM” course for design of electronic modules/micro-systems
Author
Pantazica, Mihaela ; Codreanu, Norocel
Author_Institution
Center for Technol. Electron. & Interconnection Tech., Politeh. Univ. of Bucharest, Bucharest, Romania
fYear
2009
fDate
17-20 Sept. 2009
Firstpage
45
Lastpage
49
Abstract
The objective of this paper is to present a multi-media design for manufacturing (DFM) course developed in our university and to emphasize the importance of such interactive courses in relationship with other forms of instruction as students expect today to receive more individualized training. Multi-media instruction offers multiple benefits to education, including a wide range of instructional options and, with adequate instructional design, considerable reduction of the learning time, the time of expert teachers, and when large numbers of students are involved, the cost of learning. The multi-media "DFM" course for design of electronic modules/micro-systems is part of an European project, Elect2eat (E-learning education and continuing training to electronics assembling technology), which is a public, multi-lingual training system. Another European project, mSysTech (E-training microsystems technologies), starts from this multi-media "DFM" course, being focused on the transfer of innovation in the field of micro-systems in Romania and Bulgaria. Its main objective is adapting and implementing the e-learning environment with training materials based on simulations and demonstrations to improve skills in micro-systems technology.
Keywords
design for manufacture; educational courses; micromechanical devices; multimedia communication; training; Bulgaria; E-learning education; E-training microsystems technologies; Elect2eat; European project; Romania; continuing training; design for manufacturing; electronic modules; electronics assembling technology; individualized training; mSysTech; multimedia DFM course; multimedia instruction;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Conference_Location
Gyula
Print_ISBN
978-1-4244-5132-6
Electronic_ISBN
978-1-4244-5133-3
Type
conf
DOI
10.1109/SIITME.2009.5407404
Filename
5407404
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