Title :
Micro-nanosize cofilled high dielectric permittivity composites
Author :
Yu, Yue ; Dang, Zhimin ; Zha, Junwei
Author_Institution :
Key Lab. of Beijing City for Preparation & Possessing of Novel Polymer Mater., Beijing Univ. of Chem. Technol., Beijing, China
Abstract :
In recent years high dielectric permittivity (epsiv) flexible polymer-matrix composites are promising considerable attention due to their potential applications in many fields. However, it is difficult to acquire excellent dielectric properties by dispersing the fillers with single microsize solely into polymer matrix. Dielectric composite materials of micro-nanosize BaTiO3 (BT) particles embedded into a polyvinylidene fluoride (PVDF) matrix were prepared in this work. They were studied with respect to the effect of nanosize particles on microstructure and dielectric properties. Results show that the dielectric permittivity of composites with nanosize BT at suitable concentration is large if the interactions among BT fillers each other and between BT fillers and polymer are included. The SEM micrographs of films show that cofilled composites prove the interfacial interaction between PVDF and BT. The dielectric permittivity of the composite film was as high as 55 at 100 Hz by produced via this means. The electrical breakdown properties were also studied.
Keywords :
barium compounds; electric breakdown; filled polymers; nanocomposites; permittivity; scanning electron microscopy; SEM micrographs; dielectric properties; electrical breakdown properties; flexible polymer-matrix composites; interfacial interaction; micronanosize cofilled high dielectric permittivity composites; micronanosize particles; polyvinylidene fluoride matrix; Capacitors; Ceramics; Composite materials; Dielectric breakdown; Dielectric materials; Dielectric substrates; High-K gate dielectrics; Laboratories; Permittivity; Polymers; PVDF; breakdown; cofilled; composite; dielectric properties;
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
DOI :
10.1109/ICPADM.2009.5252519