Title :
Wireline and wireless RF-Interconnect for next generation SoC systems
Author :
Sai-Wang Tam ; Chang, M.F. ; Jongsun Kim
Author_Institution :
TagArray, Inc., Palo Alto, CA, USA
Abstract :
In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future SoC systems are relying more on ultra-high data rate scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we explore the use of multiband wireline and wireless RF-Interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; integrated circuit reliability; network-on-chip; SoC; low power signal transmission; mechanical flexibility; mechanical reliability; multiband wireline; nanometer CMOS technology; reconfigurable bandwidth; thermal constraints; wireless RF-interconnect; wireline RF-interconnect; CMOS integrated circuits; Hip; Metals; Optical buffering; Optical interconnections; Radio frequency; Wireless communication;
Conference_Titel :
Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
Conference_Location :
Seoul
Print_ISBN :
978-1-61284-856-3
Electronic_ISBN :
1548-3746
DOI :
10.1109/MWSCAS.2011.6026279