• DocumentCode
    3402860
  • Title

    Image deconvolution for enhancing IR images in order to detect defects in metallic plates

  • Author

    Qidwai, Uvais ; Maqbool, Mohammed

  • Author_Institution
    Comput. Sci. & Eng. Dept., Qatar Univ., Doha, Qatar
  • fYear
    2009
  • fDate
    14-17 Dec. 2009
  • Firstpage
    230
  • Lastpage
    235
  • Abstract
    In this paper, infrared (IR) imaging technique is used in conjunction with image deconvolution algorithms in order to enhance detection capabilities of the NDT personnel in detecting defects such as cracks, voids, and pitting. The main idea utilized here is the fact that the heat distribution remains fairly homogenous in a healthy metal and can be seen as a flat surface under IR imaging camera. However, things change drastically if there is a discontinuity in the homogenous metal, such as defects. This change is exploited in this work as an output of a defect function which produces this output when healthy metal image is given as an input to it. H¿ deconvolution methodology has been utilized here to isolate (deconvolve) the defect function and be able to regenerate the output image without any other obscuring elements. This can enhance the detection capability of the IR camera as well as the NDT personnel.
  • Keywords
    deconvolution; image processing; infrared imaging; nondestructive testing; plates (structures); subroutines; surface cracks; voids (solid); IR images; cracks; defect detection; flat surface; heat distribution; image deconvolution; image deconvolution algorithms; infrared imaging technique; metallic plates; nondestructive testing; pitting; voids; Cameras; Deconvolution; Infrared detectors; Infrared imaging; Optical imaging; Optical surface waves; Personnel; Surface cracks; Surface morphology; Temperature sensors; Blind Deconvolution; Defect Detection‥; H Deconvolution; IR images; Image Enhancement; Morphological Operations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing and Information Technology (ISSPIT), 2009 IEEE International Symposium on
  • Conference_Location
    Ajman
  • Print_ISBN
    978-1-4244-5949-0
  • Type

    conf

  • DOI
    10.1109/ISSPIT.2009.5407573
  • Filename
    5407573