DocumentCode
3403027
Title
Transient characteristics of integrated dipole antennas on silicon for ultra wideband wireless interconnects
Author
Watanabe, S. ; Kimoto, K. ; Kikkawa, T.
Author_Institution
Res. Center for Nanodevices & Syst., Hiroshima Univ., Japan
Volume
3
fYear
2004
fDate
20-25 June 2004
Firstpage
2277
Abstract
For our investigation of UWB dipole antennas as integrated circuit wireless interconnects, a pair of aluminum dipole antennas were fabricated on oxidized Si substrates with resistivity of 10 Ω.cm. Their feature sizes are: 1.0-6.0 mm length; 10 μm width; 3.0 mm separation; 1 μm thickness. A transmitter dipole antenna was driven by a Gaussian pulse or monocycle pulse. The pulse shape at the receiver dipole antenna was measured by a sampling oscilloscope through baluns, 180° hybrid couplers. It was found that the received waveform was the time derivative of the input Gaussian pulse because two baluns in the measurement circuit acted as time derivative devices. Consequently, the transmitter antenna input waveform and the receiver antenna output waveform were found to be identical, so that the Si integrated antennas could be used for UWB communication in an integrated circuit chip with Gaussian pulses.
Keywords
broadband antennas; dipole antennas; integrated circuit interconnections; receiving antennas; silicon; substrates; transient response; transmitting antennas; 1 micron; 1.0 to 6.0 mm; 10 micron; 3.0 mm; Gaussian pulse; UWB antennas; baluns; hybrid couplers; integrated antennas; integrated circuit chip; integrated dipole antennas; monocycle pulse; oxidized silicon substrates; receiver antenna; time derivative devices; transient characteristics; transmitter antenna; ultra wideband wireless interconnects; Dipole antennas; Integrated circuit interconnections; Pulse measurements; Receiving antennas; Shape measurement; Silicon; Transmitters; Transmitting antennas; Ultra wideband antennas; Ultra wideband technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN
0-7803-8302-8
Type
conf
DOI
10.1109/APS.2004.1331825
Filename
1331825
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