Title :
Morpack Cube: A portable 3D heterogeneous system integration platform
Author :
Chun-Chieh Chiu ; Chih-Hsing Lin ; Chih-Chyau Yang ; Yi-Jun Liu ; Ssu-Ying Chen ; Jin-Ju Chue ; Chih-Ting Kuo ; Gang-Neng Sung ; Chun-Pin Lin ; Chien-Ming Wu ; Chun-Ming Huang
Author_Institution :
Nat. Chip Implementation Center (CIC), Hsinchu, Taiwan
Abstract :
This paper proposes a portable three-dimensional (3D) heterogeneous system integration platform with reusable sockets, namely, morphing package Cube (MorPACK Cube). The architecture of MorPACK Cube platform achieves the features of miniaturization and portability without a carrier board. Our proposed MorPACK Cube integrates accelerometer sensor, gyroscope sensor and electronic compasses sensor and then exhibits on Andriod platform through Bluetooth wireless communication. Furthermore, we develop an Mobile APP, namely SigView, to display and analysis the collected data from these sensors. The proposed MorPACK Cube is used for sensor applications to demonstrate the effectiveness, compared with the total area 434cm2 obtained by implementing MorPACK Cube platform with a carrier board, the results show that there are 91.14% area cost reduced by the MorPACK Cube platform without a carrier board. Besides, around 60% performance improvement of operation frequency can be benefited from the 3D-stacking technique.
Keywords :
electric connectors; system-in-package; system-on-chip; three-dimensional integrated circuits; 3D-stacking technique; Andriod platform; Bluetooth wireless communication; MorPACK cube platform; SigView mobile APP; accelerometer sensor; electronic compasses sensor; gyroscope sensor; morphing package cube; portability; portable 3D heterogeneous system integration platform; portable three-dimensional heterogeneous system integration platform; reusable sockets; system-on-chip; Compass; Computer architecture; Field programmable gate arrays; SDRAM; Software; Substrates; 3D Heterogeneous Integrated Platform; Bluetooth; Mor-PACK; Sensor;
Conference_Titel :
SOC Conference (SOCC), 2013 IEEE 26th International
Conference_Location :
Erlangen
DOI :
10.1109/SOCC.2013.6749687