• DocumentCode
    3403461
  • Title

    Morpack Cube: A portable 3D heterogeneous system integration platform

  • Author

    Chun-Chieh Chiu ; Chih-Hsing Lin ; Chih-Chyau Yang ; Yi-Jun Liu ; Ssu-Ying Chen ; Jin-Ju Chue ; Chih-Ting Kuo ; Gang-Neng Sung ; Chun-Pin Lin ; Chien-Ming Wu ; Chun-Ming Huang

  • Author_Institution
    Nat. Chip Implementation Center (CIC), Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    4-6 Sept. 2013
  • Firstpage
    197
  • Lastpage
    202
  • Abstract
    This paper proposes a portable three-dimensional (3D) heterogeneous system integration platform with reusable sockets, namely, morphing package Cube (MorPACK Cube). The architecture of MorPACK Cube platform achieves the features of miniaturization and portability without a carrier board. Our proposed MorPACK Cube integrates accelerometer sensor, gyroscope sensor and electronic compasses sensor and then exhibits on Andriod platform through Bluetooth wireless communication. Furthermore, we develop an Mobile APP, namely SigView, to display and analysis the collected data from these sensors. The proposed MorPACK Cube is used for sensor applications to demonstrate the effectiveness, compared with the total area 434cm2 obtained by implementing MorPACK Cube platform with a carrier board, the results show that there are 91.14% area cost reduced by the MorPACK Cube platform without a carrier board. Besides, around 60% performance improvement of operation frequency can be benefited from the 3D-stacking technique.
  • Keywords
    electric connectors; system-in-package; system-on-chip; three-dimensional integrated circuits; 3D-stacking technique; Andriod platform; Bluetooth wireless communication; MorPACK cube platform; SigView mobile APP; accelerometer sensor; electronic compasses sensor; gyroscope sensor; morphing package cube; portability; portable 3D heterogeneous system integration platform; portable three-dimensional heterogeneous system integration platform; reusable sockets; system-on-chip; Compass; Computer architecture; Field programmable gate arrays; SDRAM; Software; Substrates; 3D Heterogeneous Integrated Platform; Bluetooth; Mor-PACK; Sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference (SOCC), 2013 IEEE 26th International
  • Conference_Location
    Erlangen
  • ISSN
    2164-1676
  • Type

    conf

  • DOI
    10.1109/SOCC.2013.6749687
  • Filename
    6749687