DocumentCode :
3403473
Title :
Reliability and long term stability of MEMS
Author :
Brown, S.B. ; Jansen, E.
Author_Institution :
Failure Analysis Associates, Framingham, MA, USA
fYear :
1996
fDate :
5-9 Aug. 1996
Firstpage :
9
Lastpage :
10
Abstract :
Particular attention to MEMS failure modes is important because failure modes that are negligible at a macroscopic scale become significant on the microscale. Potential modes of failure for MEMS structures include static overload, delamination, creep, and fatigue. We have been examining long term stability through the design of MEMS for accelerated testing. These include cantilever and membrane structures for both static and cyclic loading and stiction. We have identified a potential failure mode in silicon devices that was not previously known. This failure mechanism results from the effect of water on the initiation and propagation of cracks in both single and polysilicon MEMS.
Keywords :
creep; delamination; failure analysis; fatigue cracks; fatigue testing; life testing; micromechanical devices; semiconductor device reliability; semiconductor device testing; stability; MEMS; Si; accelerated testing; cantilever structures; crack propagation; creep; cyclic loading; delamination; failure modes; fatigue; long term stability; membrane structures; polysilicon MEMS; reliability; single crystal Si devices; static loading; static overload; stiction; water effect; Biomembranes; Commercialization; Costs; Creep; Failure analysis; Fatigue; Micromechanical devices; Sensor phenomena and characterization; Stability; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Applications of Lasers in Materials Processing/Broadband Optical Networks/Smart Pixels/Optical MEMs and Their Applications. IEEE/LEOS 1996 Summer Topical Meetings:
Conference_Location :
Keystone, CO, USA
Print_ISBN :
0-7803-3175-3
Type :
conf
DOI :
10.1109/LEOSST.1996.540771
Filename :
540771
Link To Document :
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