• DocumentCode
    3403660
  • Title

    Wavelength multiplexers by cascading 3D vertical couplers

  • Author

    Liu, Bin ; Shakouri, Ali ; Abraham, P. ; Bowers, John E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    409
  • Abstract
    Increasing integration density is a key factor to reduce cost and improve performance in optoelectronic circuits. We demonstrate a wavelength multiplexer by cascading strongly coupled 3D vertical couplers using wafer fusion and a double-sided processing technique
  • Keywords
    integrated optoelectronics; multiplexing equipment; optical couplers; wafer bonding; wavelength division multiplexing; cascading; double-sided processing technique; integration density; optoelectronic circuits; strongly coupled 3D vertical couplers; wafer fusion; wavelength multiplexers; Channel spacing; Directional couplers; Etching; Indium phosphide; Multiplexing; Optical interconnections; Optical waveguides; Photonic integrated circuits; Substrates; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
  • Conference_Location
    San Francisco, CA
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-5634-9
  • Type

    conf

  • DOI
    10.1109/LEOS.1999.811772
  • Filename
    811772
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3403660