High speed MiniDIL package technology

With the drastic expansion of Internet usage, the demand for high-speed transmission devices, especially 2.4 Gb/s for metropolitan networks, is increasing. The key needs for the establishment of robust metropolitan networks is high speed, low cost and miniaturized system components. Recently, optical package configuration has changed from the TO-can style to MiniDIL style due to easier PCB mounting and standardization. The conventional MiniDIL optical package for an uncooled metropolitan network device is shown. Many modules with this configuration have transmission speeds of 622 Mb/s. To meet market demands for higher speeds, we have developed a high speed MiniDIL type packaging solution. The physical structure has been optimized to achieve low transmission loss for LD modules and low capacitance for PD modules