• DocumentCode
    3403856
  • Title

    AlxOy induced intermixing in GaAs/AlGaAs quantum wells

  • Author

    Cohen, M.I. ; Tan, H.H. ; Jagadish, C. ; Cohen, R.M.

  • Author_Institution
    Dept. of Electron. Mater. Eng., Australian Nat. Univ., Canberra, ACT, Australia
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    433
  • Abstract
    Quantum well interdiffusion has been widely studied in recent years due to potential applications in optoelectronics. The main advantages with the quantum well intermixing technique is the ability to selectively intermix parts of an already grown wafer to shift the excitonic energy. This can be used to integrate active and passive quantum devices without the need for regrowth or patterned growth. Commonly Impurity-Free interdiffusion (IFID) is mostly used for fabrication of active devices, due to the low defect density present after processing, and the lower degradation of the material, this is usually achieved by deposition of a dielectric on the surface of the wafer. Very recently, it was observed that IFID can be achieved by using laterally oxidized AlAs layers. These layers are commonly used for current confinement apertures in VCSELs and Edge emitters. In this paper we present results which show a systematic study of the effect of AlxOy induced interdiffusion
  • Keywords
    III-V semiconductors; MOCVD coatings; aluminium compounds; chemical interdiffusion; gallium arsenide; semiconductor quantum wells; surface diffusion; AlxOy induced intermixing; GaAs-AlO-AlGaAs; GaAs/AlGaAs quantum wells; interdiffusion; optoelectronics; Cities and towns; Degradation; Etching; Fabrication; Furnaces; Gallium arsenide; Materials science and technology; Rapid thermal annealing; Rapid thermal processing; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
  • Conference_Location
    San Francisco, CA
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-5634-9
  • Type

    conf

  • DOI
    10.1109/LEOS.1999.811784
  • Filename
    811784