Electrochemical deposition and superhydrophobic behavior of Cu(CH3(CH2)12COO)2 on stainless steel

Author

Zhao, Zhengang ; Zhang, Haifeng ; Zhao, Min ; Chen, Weiping ; Liu, Xiaowei

Author_Institution

Dept. of Microelectron., Harbin Inst. of Technol., Harbin, China

fYear

2011

fDate

12-16 Oct. 2011

Firstpage

283

Lastpage

286

Abstract

The electrochemical deposition of Cu(CH₃(CH₂)₁₂COO)₂ was presented to make the stainless steel surface superhydrophobic. The substrate was polished by abrasive paper firstly to make the micro-structures on the surface, then rough surface was covered with the Cu(CH₃(CH₂)₁₂COO)₂ by the method of electrochemical deposition. By our experiment, the deposition time affects the wettability of stainless steel surface distinctly. When the deposition time is 3 hours, the steel surface has the best hydrophobic property, and the value of contact angle of the steel plate surface is about 154.5°.

Keywords

abrasion; contact angle; copper compounds; crystal microstructure; electrodeposition; organic compounds; stainless steel; surface roughness; wetting; Cu(CH₃(CH₂)₁₂COO)₂; abrasion; contact angle; electrochemical deposition; microstructures; stainless steel; superhydrophobic surface; surface roughness; wettability; Abrasives; Contacts; Rough surfaces; Steel; Substrates; Surface roughness; Surface treatment; Cu(CH3(CH2)12COO)2; Electrochemical deposition; Stainless steel; Superhydrophobic surface;

fLanguage

English

Publisher

ieee

Conference_Titel

Optoelectronics and Microelectronics Technology (AISOMT), 2011 Academic International Symposium on

Conference_Location

Harbin

Print_ISBN

978-1-4577-0794-0

Type

conf

DOI

10.1109/AISMOT.2011.6159374

Filename

6159374