Research on anodic bonding process simulation tool

Based on a brand-new anodic bonding process model, one anodic bonding simulation tool has been established which realizes process and result visualization simulation under different temperature and voltage. The IP library was established by three basic characteristics, anodic bonding process features, commercial anodic bonding equipment and process parameters, and the process simulation module, visual simulation module and data access module of this software was written by c plus plus language. This simulation tool break through mathematical description of anodic bonding process behavior, and complete some key technologies such as extraction of parameters, prove of experimentation test, visualization of anodic bonding process and setting of IP library, besides it achieves description of parameters and simulation of anodic bonding behavior.