Title :
A MCM-D-type module for the ATLAS pixel detector
Author :
Becks, K.-H. ; Beyne, E. ; Ehrmann, O. ; Gerlach, P. ; Gregor, I.M. ; Pieters, P. ; Töpper, M. ; Truzzi, C. ; Wolf, J.
Author_Institution :
Dept. of Phys., Wuppertal Univ., Germany
Abstract :
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel detector. A module consists of a sensor tile with an active area of 16.4 mm×60.4 mm, 16 read out IC´s, each serving 24×160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The dies are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented
Keywords :
flip-chip devices; multichip modules; nuclear electronics; position sensitive particle detectors; silicon radiation detectors; ATLAS; MCM-D-module; Si; dies; flip-chip assembly; module controller chip; multi-chip module; optical transceiver; pixel detector; sensor tile; Detectors; Large Hadron Collider; Optical control; Optical interconnections; Optical sensors; Photonic integrated circuits; Power distribution; Power system interconnection; Tiles; Transceivers;
Conference_Titel :
Nuclear Science Symposium, 1998. Conference Record. 1998 IEEE
Conference_Location :
Toronto, Ont.
Print_ISBN :
0-7803-5021-9
DOI :
10.1109/NSSMIC.1998.774804
