A MCM-D-type module for the ATLAS pixel detector

Author

Becks, K.-H. ; Beyne, E. ; Ehrmann, O. ; Gerlach, P. ; Gregor, I.M. ; Pieters, P. ; Töpper, M. ; Truzzi, C. ; Wolf, J.

Author_Institution

Dept. of Phys., Wuppertal Univ., Germany

Volume

1

fYear

1998

fDate

1998

Firstpage

38

Abstract

For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel detector. A module consists of a sensor tile with an active area of 16.4 mm×60.4 mm, 16 read out IC´s, each serving 24×160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The dies are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented

Keywords

flip-chip devices; multichip modules; nuclear electronics; position sensitive particle detectors; silicon radiation detectors; ATLAS; MCM-D-module; Si; dies; flip-chip assembly; module controller chip; multi-chip module; optical transceiver; pixel detector; sensor tile; Detectors; Large Hadron Collider; Optical control; Optical interconnections; Optical sensors; Photonic integrated circuits; Power distribution; Power system interconnection; Tiles; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Nuclear Science Symposium, 1998. Conference Record. 1998 IEEE

Conference_Location

Toronto, Ont.

ISSN

1082-3654

Print_ISBN

0-7803-5021-9

Type

conf

DOI

10.1109/NSSMIC.1998.774804

Filename

774804