DocumentCode :
3405405
Title :
Effects of interface characteristics of Cu/Cr phases on the contact performance of Cu-25Cr alloy contact material
Author :
Miao, Baihe ; Guo, Hui ; Zhang, Yan ; Liu, Guoxun ; Wang, Wenbin
Author_Institution :
Univ. of Sci. & Technol., Beijing
Volume :
1
fYear :
2008
fDate :
15-19 Sept. 2008
Firstpage :
185
Lastpage :
188
Abstract :
The microstructure and interface of Cu/Cr phases in vacuum casting Cu-25Cr alloy and sintered CuCr25 p/m contact materials were investigated by transmission electron microscopy (TEM). Some fine secondary Cr-dendrites have preferred orientation relationships of (110)Cr // (111)Cu and [011]Cr // [1macr12]Cu, and a single set of misfit dislocations separated by a space of ~6 nm are distributed on the semicoherent interfaces of Cr/Cu phases, which shown that the interface structure of two phases in the Cu-25Cr alloy material is better coordination. In contrast to the Cu-25Cr alloy material, incoherent interface between Cr/Cu particles in CuCr25 p/m material were formed by frictional force, and a few inclusions of Al2O3 and Cr2O3 were aggregated on the lose bonding interface of Cr/Cu particles in the materials. Thereby the effects of interface structure of Cr/Cu phases in the CuCr contact materials on the mechanical properties, fracture characteristics and contact performance of contact materials are discussed.
Keywords :
chromium alloys; copper alloys; electrical contacts; transmission electron microscopy; vacuum casting; alloy material; contact material; incoherent interface; interface structure; transmission electron microscopy; vacuum casting; Casting; Chromium alloys; Composite materials; Contacts; Copper alloys; Dielectric materials; Joining materials; Magnetic materials; Mechanical factors; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 2008. ISDEIV 2008. 23rd International Symposium on
Conference_Location :
Bucharest
ISSN :
1093-2941
Print_ISBN :
978-973-755-382-9
Electronic_ISBN :
1093-2941
Type :
conf
DOI :
10.1109/DEIV.2008.4676750
Filename :
4676750
Link To Document :
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