• DocumentCode
    3405886
  • Title

    Using the MIL-C-38999 test fixture and an S-parameter test set to measure the transfer impedance of a new universal ground adapter

  • Author

    Schade, Nicholas ; Obara, Michael ; Dixon, David

  • Author_Institution
    US Naval Underwater Syst. Center, New London, CT, USA
  • fYear
    1990
  • fDate
    21-23 Aug 1990
  • Firstpage
    310
  • Lastpage
    315
  • Abstract
    In the course of developing a shield ground adapter (SGA), two deficiencies were found: existing technology ground adapters require shipyards to stock large numbers of ground adapters of different sizes and style, and the frequency range of the test fixture is limited. NUSC has developed a ground adapter that works equally well with different cables, conduits, and stuffing tubes in a wide range of different size combinations. In conjunction with this development the modified MIL-C-3899 triaxial test fixture has been combined with a network analyzer S-parameter test set to extend the usable frequency range and sensitivity of the test method to one GHz. An added benefit of the UGA (universal ground adapter) is the ability to connect various sizes of conduits from various vendors to ground using a minimum number of stocked parts. The new transfer impedance test method developed along with the UGA effort will be used to verify the EMP (electromagnetic pulse) performance of Navy shipboard conduits and fittings
  • Keywords
    S-parameters; earthing; electric impedance measurement; military equipment; network analysers; ships; EMP protection; MIL-C-38999 test fixture; US Navy ships; network analyzer S-parameter test set; shield ground adapter; transfer impedance; universal ground adapter; Contacts; EMP radiation effects; Fixtures; Grounding; Impedance measurement; Marine vehicles; Scattering parameters; System testing; Underwater cables; Yarn;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1990. Symposium Record., 1990 IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-7264-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.1990.252779
  • Filename
    252779