• DocumentCode
    3406106
  • Title

    A technique of electromagnetic interference measurements with high-impedance electric and low-impedance magnetic fields inside a TEM cell

  • Author

    Das, Sisir ; Venkatesan, V. ; Sinha, B. ; Uma, G.

  • Author_Institution
    Centre for Electromagn. Society for Appl. Microwave Electron. Eng. & Res., Madras, India
  • fYear
    1990
  • fDate
    21-23 Aug 1990
  • Firstpage
    367
  • Lastpage
    369
  • Abstract
    Transverse electromagnetic (TEM) cells are usually used to perform electromagnetic interference (EMI) measurements of equipment inside the cell in a plane wave-field environment. A newly developed technique of generating predominantly high-impedance electric or low-impedance magnetic fields inside a TEM cell for EMI measurements of relatively small printed circuit boards (PCBs), electronic devices, etc., is described. The technique simulates environments similar to the near-field EMI environment for intrasystem EMI/EMC (electromagnetic compatibility) studies. Variations of electric and magnetic fields, as well as impedances along the length of the cell, are given. The results indicate that a test region of reasonable size exists in the cell over which the field amplitudes are uniform within ±1 dB
  • Keywords
    electric variables measurement; electromagnetic interference; printed circuit testing; EMI testing; TEM cell; electromagnetic interference measurements; electronic devices; high-impedance electric fields; low-impedance magnetic fields; near-field EMI environment; plane wave-field environment; printed circuit boards; Circuit simulation; Electric variables measurement; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic measurements; Electromagnetic scattering; Magnetic field measurement; Performance evaluation; Printed circuits; TEM cells;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1990. Symposium Record., 1990 IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-7264-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.1990.252790
  • Filename
    252790