DocumentCode
3406130
Title
Test quality and yield analysis using the DEFAM defect to fault mapper
Author
Gaitonde, D.D. ; Walker, D.M.H.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
1993
fDate
7-11 Nov. 1993
Firstpage
202
Lastpage
205
Abstract
This paper describes the DEFAM defect to fault mapper, and its use in test quality analysis and yield prediction. DEFAM analyzes the effects of spot defects in the manufacturing process on a design, and computes the probability of circuit faults that may occur. Unlike traditional tools, DEFAM exploits the design hierarchy to reduce the simulation effort needed. It also reports hierarchical faults that can be fed into a hierarchical fault simulator. Yield analysis results are given for designs of up to 164K transistors. Test quality analysis results are given for an adder module.
Keywords
circuit optimisation; DEFAM defect to fault mapper; circuit faults; design hierarchy; hierarchical fault simulator; manufacturing process; spot defects; test quality analysis; yield prediction; Circuit analysis computing; Circuit faults; Circuit simulation; Circuit testing; Computational modeling; Monte Carlo methods; Probability; Process design; Statistics; Tiles;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 1993. ICCAD-93. Digest of Technical Papers., 1993 IEEE/ACM International Conference on
Conference_Location
Santa Clara, CA, USA
Print_ISBN
0-8186-4490-7
Type
conf
DOI
10.1109/ICCAD.1993.580056
Filename
580056
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