• DocumentCode
    3406130
  • Title

    Test quality and yield analysis using the DEFAM defect to fault mapper

  • Author

    Gaitonde, D.D. ; Walker, D.M.H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    1993
  • fDate
    7-11 Nov. 1993
  • Firstpage
    202
  • Lastpage
    205
  • Abstract
    This paper describes the DEFAM defect to fault mapper, and its use in test quality analysis and yield prediction. DEFAM analyzes the effects of spot defects in the manufacturing process on a design, and computes the probability of circuit faults that may occur. Unlike traditional tools, DEFAM exploits the design hierarchy to reduce the simulation effort needed. It also reports hierarchical faults that can be fed into a hierarchical fault simulator. Yield analysis results are given for designs of up to 164K transistors. Test quality analysis results are given for an adder module.
  • Keywords
    circuit optimisation; DEFAM defect to fault mapper; circuit faults; design hierarchy; hierarchical fault simulator; manufacturing process; spot defects; test quality analysis; yield prediction; Circuit analysis computing; Circuit faults; Circuit simulation; Circuit testing; Computational modeling; Monte Carlo methods; Probability; Process design; Statistics; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1993. ICCAD-93. Digest of Technical Papers., 1993 IEEE/ACM International Conference on
  • Conference_Location
    Santa Clara, CA, USA
  • Print_ISBN
    0-8186-4490-7
  • Type

    conf

  • DOI
    10.1109/ICCAD.1993.580056
  • Filename
    580056