DocumentCode :
3406273
Title :
An HMIC I/Q modulator/demodulator for RFID applications
Author :
Boles, Timothy ; Houlihan, Richard ; Weigand, Christopher
Author_Institution :
M/A-COM, Burlington, MA, USA
Volume :
2
fYear :
2005
fDate :
4-7 Dec. 2005
Abstract :
HMIC is a microwave and mmW integrated circuit topology that can create three dimensional structures based upon an intimate marriage of silicon and glass at a wafer scale level which enable high performance, low loss, lower cost realizations of many of the classic hybrid MMIC´s. In addition, the unique nature of the bonding together of these two dissimilar materials into common substrate allows the monolithic insertion of active elements in combination with low loss, high Q, lumped element passive components to produce microwave circuits that can be realized no other way or at as low a cost. This paper will illustrate the results of the development of an integrated I/Q modulator/demodulator MMIC for RFID reader applications using HMIC technology as an integration medium. The resultant RF performance improvements and advantages of the modulator and the overall effect on RFID wireless systems operation will be presented.
Keywords :
MMIC; glass; millimetre wave integrated circuits; modulation; network topology; radiofrequency identification; silicon; wafer-scale integration; HMIC technology; I/Q demodulator; I/Q modulator; RFID reader; RFID wireless systems operation; circuit topology; hybrid MMIC; lumped element passive components; microwave integrated circuit; mm wave integrated circuit; Circuit topology; Costs; Demodulation; Glass; Hybrid integrated circuits; Microwave integrated circuits; Performance loss; Radiofrequency identification; Silicon; Wafer bonding; Demodulator; HMIC; Mixer; Modulator; RFID; RFID reader; SOI;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
Type :
conf
DOI :
10.1109/APMC.2005.1606496
Filename :
1606496
Link To Document :
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