Title :
An efficient method for RF integrated circuit analysis
Author :
Dumitriu, Lucia ; Iordache, Mihai ; Popescu, Catalina
Author_Institution :
Electr. Eng. Dept., Politeh. Univ. of Bucharest, Bucharest
Abstract :
The paper presents a new version of the modified nodal method in transient behavior (the semi-state equations) for the analysis of the circuits driven by signals with widely separated time scales. The key idea is to use multiple time variables, which enable signals with widely separated rates of variation to be represented efficiently. The semi-state equation formulation in a partially symbolic form is used in order to obtain a MPDE (multi-time partial differential equation) form with a minimum number of independent variables. Combining an efficient procedure to compute the appropriate boundary conditions of the MPDE, with the semi-state approach, in which only the symbols of the parameters corresponding to the nonlinear circuit elements are considered, a significant efficiency in circuit design accelerating the reaching of the periodic steady state, and an improvement of the accuracy in the numerical calculations are obtained. The algorithm to formulate and to solve the dynamic modified nodal equations was implemented in a computing program, which constitutes a useful tool for steady-state analysis of a very large class of nonlinear analog circuits.
Keywords :
integrated circuit design; integrated circuit modelling; partial differential equations; radiofrequency integrated circuits; transient analysis; MPDE; RF circuit design; RF integrated circuit analysis; dynamic modified nodal method; multitime partial differential equation; nonlinear analog circuits; nonlinear circuit elements; semistate equations; steady-state analysis; transient analysis; Boundary conditions; Circuit analysis; Differential equations; Nonlinear circuits; Partial differential equations; Radio frequency; Radiofrequency integrated circuits; Signal analysis; Steady-state; Transient analysis;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 2008. ISDEIV 2008. 23rd International Symposium on
Conference_Location :
Bucharest
Print_ISBN :
978-973-755-382-9
Electronic_ISBN :
1093-2941
DOI :
10.1109/DEIV.2008.4676826