• DocumentCode
    3407194
  • Title

    Susceptibility analysis of complex systems

  • Author

    Canavero, Flavio ; Pignari, Sergio ; Daniele, Vito

  • Author_Institution
    Dipartimento di Elettronica, Politecnico, Turin, Italy
  • fYear
    1990
  • fDate
    21-23 Aug 1990
  • Firstpage
    618
  • Lastpage
    621
  • Abstract
    A study of electromagnetic coupling effects on systems containing distributed elements and lumped linear components is presented. The structure is decomposed into sections containing multiconductor transmission lines and interconnection blocks holding lumped elements. The external field is assumed to interfere with line sections, but mutual influences among different sections are neglected. Both the sections and the blocks are treated as multiport components and characterized by their scattering parameters. The analysis is based on a correspondence matrix that accounts for the topology of connections between sections and blocks. Closed-form solutions are derived in the Laplace domain, and the temporal evolution of voltages and currents at any of the system ports is obtained by a numerical inversion. This method makes it possible to predict the susceptibility of complex systems and to verify the intra-system compatibility (especially crosstalk). The relative influence of circuit components and of line layouts on the severity of interferences is evidenced by simulation results
  • Keywords
    electromagnetic compatibility; electromagnetic induction; electromagnetic interference; linear network analysis; lumped parameter networks; matrix algebra; EMC; Laplace domain; circuit components; closed form solutions; complex systems; correspondence matrix; crosstalk; currents; distributed elements; electromagnetic coupling effects; external field; interconnection blocks; interferences; line layouts; lumped elements; lumped linear components; multiconductor transmission lines; multiport components; numerical inversion; scattering parameters; simulation results; susceptibility analysis; system ports; temporal evolution; topology; voltages; Closed-form solution; Crosstalk; Electromagnetic coupling; Integrated circuit interconnections; Interference; Multiconductor transmission lines; Scattering parameters; Topology; Transmission line matrix methods; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1990. Symposium Record., 1990 IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-7264-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.1990.252843
  • Filename
    252843