DocumentCode :
3407467
Title :
Layout Uniformity: A metric for yield enhancement
Author :
Lachkar, H. ; Rizzo, O. ; Portal, J.-M. ; Ginez, O.
Author_Institution :
IM2NP, Marseille, France
fYear :
2011
fDate :
7-10 Aug. 2011
Firstpage :
1
Lastpage :
4
Abstract :
The purpose of this paper is to study the relation between the layout features and the DFM flow effectiveness. First, a brief overview of the Design for Manufacturing (DfM) techniques used in yield aware RTL-to-GDSII design flow is given. This overview points out the possible relationship between the layout feature, i.e. density and uniformity and the DFM effectiveness. In order to validate layout uniformity as a first order metric to quantify layout sensitivity to DfM improvement, experiment is performed on industrial test case. The results of this experiment validate clearly that layout uniformity improvement correlates with CA and Lithography improvements.
Keywords :
design for manufacture; integrated circuit layout; integrated circuit yield; lithography; DFM flow effectiveness; RTL-to-GDSII design flow; design for manufacturing; first order metric; industrial test case; layout features; layout uniformity; lithography; yield enhancement; Manufacturing; CA; CMP; Design for Manufacturability and Yield; OPC; Place & Route; SoCs; Uniformity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
Conference_Location :
Seoul
ISSN :
1548-3746
Print_ISBN :
978-1-61284-856-3
Electronic_ISBN :
1548-3746
Type :
conf
DOI :
10.1109/MWSCAS.2011.6026576
Filename :
6026576
Link To Document :
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