Carbon and tungsten sputtering in a helium magnetron discharge

Author

Tiron, V. ; Andrei, C. ; Nastuta, A.V. ; Rusu, G.B. ; Vitelaru, C. ; Popa, G.

Author_Institution

Fac. of Phys., Al. I. Cuza Univ., Iasi

Volume

2

fYear

2008

fDate

15-19 Sept. 2008

Firstpage

615

Lastpage

618

Abstract

This study reports on carbon and tungsten deposition on a heated silicon substrate under He⁺ bombardment in a magnetron sputtering device. The discharge was operated at constant pressure of 1.33 Pa for two discharge current intensities (200 mA and 600 mA) and target power density up to 40 Wcm^-2. The deposited films were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM) and X-ray diffractometry (XRD). The topography and cross section reveals the influence of the target power density on the surface roughness, grains size and thickness of the deposited films.

Keywords

X-ray diffraction; atomic force microscopy; carbon; grain size; metallic thin films; plasma deposited coatings; plasma deposition; scanning electron microscopy; sputter deposition; sputtered coatings; surface roughness; tungsten; AFM; C; He⁺ bombardment; SEM; Si; W; X-ray diffractometry; XRD; atomic force microscopy; carbon film deposition; current 200 mA; current 600 mA; film thickness; grains size; heated silicon substrate; helium magnetron discharge; pressure 1.33 Pa; scanning electron microscopy; sputtering; surface roughness; surface topography; tungsten film deposition; Atomic force microscopy; Atomic layer deposition; Helium; Magnetic devices; Scanning electron microscopy; Silicon; Sputtering; Tungsten; X-ray diffraction; X-ray scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

Discharges and Electrical Insulation in Vacuum, 2008. ISDEIV 2008. 23rd International Symposium on

Conference_Location

Bucharest

ISSN

1093-2941

Print_ISBN

978-973-755-382-9

Electronic_ISBN

1093-2941

Type

conf

DOI

10.1109/DEIV.2008.4676874

Filename

4676874