Title :
High speed parallel multi-chip interconnection with free space optics
Author :
Zheng, Xuezhe ; Marchand, Philippe J. ; Huang, Dawei ; Esener, Sadik C.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
Abstract :
In many MCM applications, data distribution from and to the memory chips that may reside on an MCM or on a adjacent board can become one of the key bottlenecks in high performance system implementation. This type of performance-limited data paths can be replaced by using an free-space optical interconnect (FSOI) module with crossbar connectivity between point to point interconnects. This system can be made into a standard data communication module for various applications (interconnect processors, DSP chips, memory and telecom interface circuits)
Keywords :
multichip modules; optical interconnections; MCM; crossbar connectivity; data communication module; free-space optical interconnect; high-speed parallel multi-chip interconnection; memory chip; point-to-point interconnect; High speed optical techniques; Integrated circuit interconnections; Optical arrays; Optical buffering; Optical interconnections; Optical receivers; Packaging; Sensor arrays; Silicon; Vertical cavity surface emitting lasers;
Conference_Titel :
LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5634-9
DOI :
10.1109/LEOS.1999.812018
