Title :
UWB chip antenna design using LTCC multilayer technology for mobile applications
Author :
Wu, Chun-Yih ; Tang, Chia-Lun ; Chen, An-Chia
Author_Institution :
Comput. & Commun. & Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
A compact surface-mount ultra-wideband (UWB) chip antenna fabricated using multilayer low-temperature co-fired ceramic (LTCC) technology is presented. The antenna, suitable for mobile applications, is of a two layered metal-plate structure and occupies a compact size of 14 × 10 × 1.5 mm3 only. With a very wide operating bandwidth of about 4.98 GHz, the antenna can cover the lower band of DS-UWB (3.1-4.85 GHz). The antenna radiation patterns at 4.0 GHz and the antenna gain are also measured and discussed.
Keywords :
antenna radiation patterns; ceramic packaging; microwave antennas; mobile antennas; surface mount technology; ultra wideband antennas; 3.1 to 4.85 GHz; DS-UWB; LTCC multilayer technology; UWB chip antenna design; antenna gain; antenna radiation patterns; low-temperature co-fired ceramic technology; metal-plate structure; mobile antenna; ultra-wideband chip antenna; Antenna measurements; Antenna radiation patterns; Bandwidth; Ceramics; Gain measurement; Mobile antennas; Nonhomogeneous media; Surface-mount technology; Ultra wideband antennas; Ultra wideband technology;
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
DOI :
10.1109/APMC.2005.1606570
