Title :
3-D electromagnetic finite element analysis as an integral part of the board design process
Author :
Brauer, John R. ; DeFord, John E. ; Wallen, Patrick
Author_Institution :
Ansoft Corp., Milwaukee, WI, USA
Abstract :
Behavior of signals in circuit boards can be predicted using three dimensional electromagnetic finite element analysis. For intermediate frequencies and clock rates, capacitance and inductance matrices can be computed by 3-D finite elements and used in circuit models to calculate transient signal waveforms. For higher frequencies, S-parameters must be used, and they can be computed using full wave 3-D finite element analysis. Both circuit parameters and S-parameters of typical circuit boards are computed using finite element analysis
Keywords :
S-parameters; finite element analysis; printed circuit design; 3D electromagnetic finite element analysis; S-parameters; capacitance matrix; circuit board design; circuit model; circuit parameters; inductance matrix; transient signal waveform; Capacitance; Clocks; Electromagnetic analysis; Finite element methods; Frequency; Inductance; Integral equations; Printed circuits; Scattering parameters; Signal analysis;
Conference_Titel :
WESCON/96
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-3274-1
DOI :
10.1109/WESCON.1996.554010