DocumentCode
3407747
Title
3-D electromagnetic finite element analysis as an integral part of the board design process
Author
Brauer, John R. ; DeFord, John E. ; Wallen, Patrick
Author_Institution
Ansoft Corp., Milwaukee, WI, USA
fYear
1996
fDate
22-24 Oct 1996
Firstpage
334
Lastpage
339
Abstract
Behavior of signals in circuit boards can be predicted using three dimensional electromagnetic finite element analysis. For intermediate frequencies and clock rates, capacitance and inductance matrices can be computed by 3-D finite elements and used in circuit models to calculate transient signal waveforms. For higher frequencies, S-parameters must be used, and they can be computed using full wave 3-D finite element analysis. Both circuit parameters and S-parameters of typical circuit boards are computed using finite element analysis
Keywords
S-parameters; finite element analysis; printed circuit design; 3D electromagnetic finite element analysis; S-parameters; capacitance matrix; circuit board design; circuit model; circuit parameters; inductance matrix; transient signal waveform; Capacitance; Clocks; Electromagnetic analysis; Finite element methods; Frequency; Inductance; Integral equations; Printed circuits; Scattering parameters; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/96
Conference_Location
Anaheim, CA
ISSN
1095-791X
Print_ISBN
0-7803-3274-1
Type
conf
DOI
10.1109/WESCON.1996.554010
Filename
554010
Link To Document