• DocumentCode
    3407747
  • Title

    3-D electromagnetic finite element analysis as an integral part of the board design process

  • Author

    Brauer, John R. ; DeFord, John E. ; Wallen, Patrick

  • Author_Institution
    Ansoft Corp., Milwaukee, WI, USA
  • fYear
    1996
  • fDate
    22-24 Oct 1996
  • Firstpage
    334
  • Lastpage
    339
  • Abstract
    Behavior of signals in circuit boards can be predicted using three dimensional electromagnetic finite element analysis. For intermediate frequencies and clock rates, capacitance and inductance matrices can be computed by 3-D finite elements and used in circuit models to calculate transient signal waveforms. For higher frequencies, S-parameters must be used, and they can be computed using full wave 3-D finite element analysis. Both circuit parameters and S-parameters of typical circuit boards are computed using finite element analysis
  • Keywords
    S-parameters; finite element analysis; printed circuit design; 3D electromagnetic finite element analysis; S-parameters; capacitance matrix; circuit board design; circuit model; circuit parameters; inductance matrix; transient signal waveform; Capacitance; Clocks; Electromagnetic analysis; Finite element methods; Frequency; Inductance; Integral equations; Printed circuits; Scattering parameters; Signal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    WESCON/96
  • Conference_Location
    Anaheim, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-3274-1
  • Type

    conf

  • DOI
    10.1109/WESCON.1996.554010
  • Filename
    554010